Exclusive

Publication

Byline

Location

US Patent Issued to NISSAN CHEMICAL on April 21 for "Film-forming composition having a multiple bond" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,936, issued on April 21, was assigned to NISSAN CHEMICAL Corp. (Tokyo). "Film-forming composition having a multiple bond" was invented by ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Photoresist top coating material for etching rate control" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,937, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Photoresist top coating material ... Read More


US Patent Issued to ASML NETHERLANDS on April 21 for "Imaging system" (Dutch Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,938, issued on April 21, was assigned to ASML NETHERLANDS B.V. (Veldhoven, Netherlands). "Imaging system" was invented by Albertus Hartger... Read More


US Patent Issued to XSYS PREPRESS on April 21 for "Method and system to determine an exposure time and/or intensity to be used for obtaining a desired feature of a relief structure" (Belgian, German Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,939, issued on April 21, was assigned to XSYS PREPRESS NV (Ypres, Belgium). "Method and system to determine an exposure time and/or intens... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Reticle masking device, substrate processing apparatus including the same, and substrate processing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,940, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Reticle masking device, substrate processi... Read More


US Patent Issued to WINBOND ELECTRONICS on April 21 for "Semiconductor structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,941, issued on April 21, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for formin... Read More


US Patent Issued to ASML NETHERLANDS on April 21 for "Metrology methods and apparatuses for lithographic performance parameter evaluation using probability descriptions" (Dutch Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,942, issued on April 21, was assigned to ASML NETHERLANDS B.V. (Veldhoven, Netherlands). "Metrology methods and apparatuses for lithograph... Read More


US Patent Issued to Ushio Denki on April 21 for "Exposure apparatus" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,943, issued on April 21, was assigned to Ushio Denki K.K. (Tokyo). "Exposure apparatus" was invented by Naoya Sohara (Tokyo). According t... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Extreme ultraviolet source cleaning apparatus, EUV source cleaning method using the same, and substrate processing method including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,944, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Extreme ultraviolet source cleaning appara... Read More


US Patent Issued to CANON on April 21 for "Position measuring method, method for manufacturing article, position measuring apparatus, semiconductor manufacturing apparatus, and imprint apparatus" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,945, issued on April 21, was assigned to CANON K.K. (Tokyo). "Position measuring method, method for manufacturing article, position measur... Read More